Welcome to FLYcncpart's gold plating service! Gold plating is a high-end electroplating process that offers superior conductivity and oxidation resistance, widely used in electronic and medical devices. Our Shenzhen team ensures precise processes, helping you achieve highly reliable parts.
Description: Gold plating is an electroplating process that deposits a layer of pure gold or gold alloy onto a substrate surface through electrolysis. The thickness is typically 0.5-5μm. Gold plating can be categorized as soft gold (pure gold) or hard gold (gold-cobalt alloy). The process includes pre-plating with a base layer (e.g., nickel), electroplating, and post-processing (cleaning and drying) to ensure layer purity and adhesion.
Applicable Materials: Copper, silver, stainless steel, titanium, and their alloys, as well as electronic substrates (e.g., circuit boards).
Visual Appearance: Golden or rose gold tones, with a high-gloss mirror or matte finish, enhance the premium feel.
Advantage
Excellent conductivity and contact performance: The gold layer has a low resistance (<0.05Ω), making it suitable for high-frequency electronic connectors and reducing signal loss. Strong Oxidation and Corrosion Resistance: Stable in humid and chemical environments, resists discoloration, and lasts for decades.
High Biocompatibility: Non-toxic and hypoallergenic, it's ideal for medical devices such as implants and probes.
Aesthetics and Decorative Features: Provides a luxurious gold appearance for use in jewelry or high-end consumer goods, enhancing product value.
Excellent Weldability: Easy to solder or braze, suitable for precision assembly.
Thickness Flexibility: Precise thickness control allows for a balance between cost and performance; environmentally friendly processes reduce the difficulty of gold scrap recycling.
Precautions
Cost Control: Gold plating is expensive, so optimize thickness to avoid waste; test a base layer (such as nickel) to prevent diffusion.
Substrate Preparation: Surfaces must be highly clean, and a pre-plated base layer should be applied to prevent gold flaking; avoid materials susceptible to hydrogen embrittlement.
Environmental Adaptability: Suitable for indoor or mild environments, tested for stability at high temperatures (>200°C).
Design Considerations: Parts should be designed for easy plating, avoiding deep grooves; shielding should be planned to protect non-plated areas. Quality Standards: Complies with MIL-G-45204 or ASTM B488 standards, testing for thickness, purity, and adhesion.
Safety Measures: Protective equipment is used during processing, and waste fluids are recycled to comply with environmental regulations.
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